ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,494, issued on June 2, was assigned to AUO Corp. (Hsin-Chu, Taiwan).

"Light emitting component array substrate" was invented by Wen-Hsien Tseng (Hsin-Chu, Taiwan) and Chia-Hui Pai (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting component array substrate includes a temporary storage substrate, a plurality of light emitting components, a plurality of first adhering patterns and a plurality of second adhering patterns. The light emitting components are disposed on the temporary storage substrate. The first adhering patterns and the second adhering patterns are respectively disposed on the light emitting components. A tr...