ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,701, issued on April 14, was assigned to ATT Advanced Temperature Test Systems GmbH (Planegg, Germany).
"Modular wafer-chuck system" was invented by Markus Eibl (Planegg, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A modular wafer-chuck system is provided for mounting or clamping and temperature control of a wafer. The modular wafer-chuck system includes: a chuck for temperature control of a wafer; and a sensor module with at least one temperature-measuring apparatus for measuring a temperature of the sensor module and/or of the chuck and/or of a wafer mounted or clamped by the wafer-chuck system. The chuck has a coupling surface configu...