US Patent Issued to Atotech Deutschland on Aug. 25 for "Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards" (German Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,133, issued on Aug. 25, was assigned to Atotech Deutschland GmbH & Co. KG (Berlin).

"Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards" was invented by Bernhard Schachtner (Berlin).

According to the abstract* released by the U.S. Patent & Trademark Office: "A process for treating a tin or tin alloy layer onto metal surfaces, preferred copper surfaces, comprising the steps of (i) providing a metal surface, preferred a copper surface, (ii) contacting the metal surface, preferred the copper surface, with a tin or tin alloy plating bath; and (iii) oxidizing the tin or tin alloy layer obtained by step (ii)."

The patent was filed on May 5, 2023,...