US Patent Issued to AT&S Austria Technologie & Systemtechnik on April 21 for "Component carrier with an embedded thermally conductive block and manufacturing method" (Austrian Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,451, issued on April 21, was assigned to AT&S Austria Technologie & Systemtechnik AG (Leoben, Austria).

"Component carrier with an embedded thermally conductive block and manufacturing method" was invented by Erich Schlaffer (St. Lorenzen, Austria) and Sebastian Sattler (Graz, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component carrier includes: i) a first layer stack (comprising at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure, ii) a component embedded in the first layer stack, where a main surface of the component is essentially flush with an outer main sur...