ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,696, issued on April 7, was assigned to AT&S (Chongqing) Co. Ltd. (Chongqing, China).

"Component carrier and method of manufacturing the same" was invented by Lei Tang (Chongqing, China) and Yung-lin Chia (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a solder resist structure on at least one of two opposing main surfaces of the stack. The solder resist structure includes at least two different kinds of solder resist provided on one of said main surfaces."

The patent was filed on S...