US Patent Issued to ASMPT SINGAPORE on July 28 for "Handling a fragile substrate for interconnect bonding" (Singaporean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,783, issued on July 28, was assigned to ASMPT SINGAPORE PTE. LTD. (Singapore).

"Handling a fragile substrate for interconnect bonding" was invented by Keng Yew Song (Singapore), Yue Zhang (Singapore) and Kim Heng Tan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding apparatus has a bonding platform including a top plate for supporting a fragile semiconductor substrate during interconnect bonding operations conducted on the substrate. Vacuum holes situated on the top plate, forming a first vacuum section, a second vacuum section, and a third vacuum section located between the first and second vacuum sections, generate vacuum suction...