ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,038, issued on Aug. 4, was assigned to ASMPT Singapore Pte. Ltd. (Singapore).
"System and method for fluxless thermocompression bonding" was invented by Zetao Ma (Hong Kong), Ming Li (Hong Kong), Chun Ho Fan (Hong Kong), Kin Yik Hung (Hong Kong) and Siu Wing Lau (Hong Kong).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding system for bonding an electronic component to a base member includes a first container for forming a first inert environment where the base member is locatable during bonding of the electronic component. A first plasma cleaning device is located in the first container to clean the electronic component and/or the base member b...