US Patent Issued to ASMPT SINGAPORE on Aug. 4 for "Combined dispensing and stamping apparatus and method for applying adhesive fluid during a bonding process" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,699,316, issued on Aug. 4, was assigned to ASMPT SINGAPORE PTE. LTD. (Singapore).

"Combined dispensing and stamping apparatus and method for applying adhesive fluid during a bonding process" was invented by Kai Siu Lam (Hong Kong), Nim Tak Wong (Hong Kong), Xiaodong Chen (Hong Kong) and Kui Kam Lam (Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for applying an adhesive fluid onto a bonding surface during a bonding process includes a positioning table, a dispensing device, a stamping device and a switching member which are mounted on the positioning table. The dispensing device is configured to be positionable by the positioning ta...