ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,022, issued on April 7, was assigned to ASMPT SINGAPORE PTE. LTD. (Singapore).
"Apparatus for applying a sintering force via a compressible film" was invented by Jiapei Ding (Singapore), Teng Hock Kuah (Singapore), Bin Yuan (Singapore), Yi Lin (Singapore) and Jian Liao (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sintering apparatus for simultaneously sintering an electronic device onto a substrate, and a metallic sheet onto the electronic device includes a sinter tool and a compressible film positionable onto the metallic sheet and the electronic device. A thickness of the compressible film is greater than a height of the metallic sh...