US Patent Issued to ASML Netherlands on March 24 for "System and method for generating predictive images for wafer inspection using machine learning" (Dutch Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,170, issued on March 24, was assigned to ASML Netherlands B.V. (Veldhoven, Netherlands).

"System and method for generating predictive images for wafer inspection using machine learning" was invented by Maxim Pisarenco (Son en Breugel, Netherlands), Scott Anderson Middlebrooks (Duizel, Netherlands), Mark John Maslow (Eindhoven, Netherlands), Marie-Claire Van Lare (Utrecht, Netherlands) and Chrysostomos Batistakis (Eindhoven, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system and method for generating predictive images for wafer inspection using machine learning are provided. Some embodiments of the system and method include acquirin...