ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,757, issued on Oct. 20, was assigned to ASM IP Holding B.V. (Almere, Netherlands).

"Substrate processing method" was invented by SangHeon Yong (Yongin-si, South Korea), HongSuk Kim (Yongin-si, South Korea), SungHa Choi (Suwon-si, South Korea), JuHyuk Park (Hwaseong-si, South Korea), KiHun Kim (Yongin-si, South Korea) and JiHye Yang (Ansan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes providing, in a reaction space, a substrate including two gaps in a surface thereof, and filling the at least two gaps with a flowable film under a pulsed plasma atmosphere, while supplying a precursor and a reacta...