ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,178, issued on June 2, was assigned to ASM IP Holding B.V. (Almere, Netherlands).

"Layer deposition with post-deposition agglomeration mitigation" was invented by Fu Tang (Gilbert, Ariz.), Eric Jen Cheng Liu (Tempe, Ariz.) and Eric James Shero (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method can comprise providing a zinc precursor to a reaction chamber comprising a substrate disposed therein; providing an oxygen species to the reaction chamber; forming a zinc oxide layer on the substrate in response to providing the zinc precursor and providing the oxygen species; and/or mitigating agglomeration of the zinc oxide layer. Mitigating agg...