ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,610, issued on July 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands).

"Method for processing a substrate" was invented by DongHyun Ko (Hwaseong-si, South Korea), HakJoon Lee (Seoul, South Korea) and SungKyu Kang (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, a particle with a first particle thickness may be formed on a film with a first thickness, followed by a plasma treatment. The first particle thickness may be reduced to a second particle thickness below an allowable limit and the first film thickness may be reduced to a second film thickness by the plasma treatment. In another embodiment, ...