US Patent Issued to ASM IP Holding on Aug. 25 for "Substrate processing method" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,116, issued on Aug. 25, was assigned to ASM IP Holding B.V. (Almere, Netherlands).

"Substrate processing method" was invented by Seungju Chun (Gyeonggi-do, South Korea) and ChangWan Lee (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method of processing a substrate, including: providing the substrate into a reaction space, the substrate comprising a gap having a predetermined cross-sectional area and a depth, performing a first sub-cycle step for depositing a gap-filling material by a predetermined thickness along a surface of the gap by an atomic layer deposition method, performing a second sub-cycle step for fo...