ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,723,321, issued on Sept. 1, was assigned to ASKA Corp. (Fukuoka, Japan).
"Jet stream type plating device" was invented by Takayuki Furusawa (Fukuoka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a nozzle structure in a jet plating tank through which the nozzle structure can be installed in the reduced space with simple composition, the plating liquid can be almost uniformly jetted on the semiconductor wafer surface and decentralization and homogenization of the plating liquid in the plating tank can be conducted, thereby thickness growth can be promoted. In the nozzle structure, a plurality of jet paths in an opening portion of the n...