US Patent Issued to ASIA VITAL COMPONENTS on July 21 for "Support structure of heat dissipation unit" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,167, issued on July 21, was assigned to ASIA VITAL COMPONENTS Co. LTD. (New Taipei City, Taiwan).

"Support structure of heat dissipation unit" was invented by Qian-Cheng Lin (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A support structure of heat dissipation unit is applicable in a heat dissipation unit. Two sides of the heat dissipation unit are respectively formed with a condensation side and an evaporation side. Two ends of the support structure respectively abut against and connect with the condensation side and the evaporation side. The support structure includes a base section and a thorny section. The base section h...