US Patent Issued to ASIA VITAL COMPONENTS (CHINA) on March 24 for "Combination thermal module and wick structure thereof" (Chinese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,695, issued on March 24, was assigned to ASIA VITAL COMPONENTS (CHINA) Co. LTD. (Shenzhen, China).

"Combination thermal module and wick structure thereof" was invented by Xiwen Xiong (Shenzhen, China), Xingxing Lyu (Shenzhen, China), Wei Liu (Shenzhen, China) and Lei Yao (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A combination thermal module includes a vapor chamber defining an airtight chamber filled with a working fluid and having at least one through hole formed thereon communicable with the airtight chamber; at least one annular wick structure provided in the airtight chamber corresponding to the through hole; and at least ...