US Patent Issued to ASAHI-SEIKI MANUFACTURING on July 28 for "Wire coating removal device and wire forming system" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,280, issued on July 28, was assigned to ASAHI-SEIKI MANUFACTURING Co. LTD. (Owariasahi, Japan).

"Wire coating removal device and wire forming system" was invented by Eiji Obayashi (Nagoya, Japan), Takashi Nojima (Nagoya, Japan) and Ryota Fukatsu (Owariasahi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wire coating removal device includes: a wire feed path; a pair of first rotary tools that remove a coating of the wire at a first position on the wire feed path; a first rotary drive mechanism that rotationally drives the pair of first rotary tools; a pair of second rotary tools that remove the coating of the wire at a second position; a sec...