US Patent Issued to ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY on Aug. 4 for "Sound-assisted crack propagation for semiconductor wafering" (Kansas, Arizona Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,697,753, issued on Aug. 4, was assigned to ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY (Scottsdale, Ariz.).

"Sound-assisted crack propagation for semiconductor wafering" was invented by Mariana Bertoni (Mesa, Ariz.) and Pablo Guimera Coll (Overland Park, Kan.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods are described for controlled crack propagation in a material using ultrasonic waves. A first stress in applied to the material such that the first stress is below a critical point of the material and is insufficient to initiate cracking of the material. A controlled ultrasound wave is then applied to the material c...