US Patent Issued to Aptiv Technologies on Sept. 15 for "Electronic module housing" (American, German Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. D1,147,971, issued on Sept. 15, was assigned to Aptiv Technologies AG (Schaffhausen, Switzerland).

"Electronic module housing" was invented by Timothy Alan Suda (Avon, Ind.) and Tobias Merten (Dusseldorf, Germany).

The patent was filed on March 6, 2024, under Application No. D/931,403.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1147971&OS=D1147971&RS=D1147971

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