US Patent Issued to Applied Materials on Sept. 8 for "Process chamber vacuum seal leakage reduction" (Indian, American Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,766, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Process chamber vacuum seal leakage reduction" was invented by Shashidhara Patel H B (Bangalore, India), Nagaraj Naik (Bangalore, India), Muhannad Mustafa (Milpitas, Calif.), Bin Cao (Fremont, Calif.), Sanjeev Baluja (Campbell, Calif.), Aditya Chuttar (Sunnyvale, Calif.) and Jae Hwa Park (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Sealing bodies comprising a first body having a top surface and a bottom surface defining a thickness thereof. An inlet conduit and an outlet conduit are in fluid communication with one or more of the top surface, th...