ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,728,445, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Method and apparatus to clean substrate with atomizing nozzle" was invented by Haosheng Wu (San Jose, Calif.), Shou-Sung Chang (Mountain View, Calif.), Hui Chen (San Jose, Calif.), Chih Chung Chou (San Jose, Calif.), Sih-Ling Yeh (Sunnyvale, Calif.), Emily Drauss (Santa Clara, Calif.), Elton Zhong (San Jose, Calif.), Chad Pollard (San Jose, Calif.), Songling Shin (Sunnyvale, Calif.), Jianshe Tang (San Jose, Calif.) and Jeonghoon Oh (Saratoga, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical polishing system includes a first polishing sta...