US Patent Issued to Applied Materials on Sept. 8 for "Laser dicing glass wafers using advanced laser sources" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,148, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Laser dicing glass wafers using advanced laser sources" was invented by Wei-Sheng Lei (San Jose, Calif.), Mahendran Chidambaram (Saratoga, Calif.), Kangkang Wang (San Jose, Calif.), Ludovic Godet (Sunnyvale, Calif.) and Visweswaren Sivaramakrishnan (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a plurality of voids within a substrate along a dicing path by exposing the substrate to a first burst of laser pulses at a first location along the dicing path of a respective waveguide combiner. The substrate has a plurality of...