US Patent Issued to Applied Materials on Sept. 15 for "Vacuum sealing integrity of cryogenic electrostatic chucks using non-contact surface temperature measuring probes" (California Inventors)

Posted On: 2026-09-15

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,736,415, issued on Sept. 15, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Vacuum sealing integrity of cryogenic electrostatic chucks using non-contact surface temperature measuring probes" was invented by Sankaranarayanan Ravi (Santa Clara, Calif.), Alvaro Garcia (Mountain View, Calif.), Martin Perez Guzman (Santa Clara, Calif.), Stephen Donald Prouty (San Jose, Calif.) and Andrew Antoine Noujaim (Morgan Hill, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure relates to a substrate support assembly and apparatus for measuring the temperature of a substrate disposed on the support assembly. In one embodiment, a subst...

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US Patent Issued to Applied Materials on Sept. 15 for "Vacuum sealing integrity of cryogenic electrostatic chucks using non-contact surface temperature measuring probes" (California Inventors)