US Patent Issued to Applied Materials on Sept. 1 for "Fluid conduit and flange for high bias applications" (American, Swiss Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,725,767, issued on Sept. 1, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Fluid conduit and flange for high bias applications" was invented by Sankaranarayanan Ravi (Santa Clara, Calif.), Alvaro Garcia (Mountain View, Calif.), Martin Perez Guzman (Santa Clara, Calif.), Stephen D. Prouty (San Jose, Calif.) and Andreas Schmid (Meyriez, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and apparatus for cooling a semiconductor chamber are described herein. A semiconductor chamber component, includes a powered region, a grounded region, and a fluid conduit disposed within the semiconductor chamber component and passing thr...