US Patent Issued to Applied Materials on Oct. 6 for "Electrostatically secured substrate support assembly" (California Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,944, issued on Oct. 6, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Electrostatically secured substrate support assembly" was invented by Arvinder Manmohan Singh Chadha (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate support assembly includes a cooling plate. The substrate support assembly further includes a chuck disposed on the cooling plate. The chuck includes one or more clamp electrodes to electrostatically secure the chuck to the cooling plate. The substrate support assembly further includes multiple mesas formed on a bottom surface of the chuck or formed on a top surface of the cooling plate to se...