US Patent Issued to Applied Materials on Oct. 6 for "Bonding layers formed of high thermal conductivity materials" (California Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,732, issued on Oct. 6, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Bonding layers formed of high thermal conductivity materials" was invented by Karthik Guda Vishnu (Milpitas, Calif.), Liu Jiang (Dublin, Calif.), El Mehdi Bazizi (San Jose, Calif.) and Siddarth Krishnan (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a structure with a backside power delivery network incorporates a high thermal conductivity material as the bonding layer. In some embodiments, the method may comprise forming a first layer stack that includes a front side metallization (FSM) signal layer formed on a silicon die lay...