US Patent Issued to Applied Materials on Oct. 27 for "Sample thickness metrology using focused beam interference" (California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,883, issued on Oct. 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Sample thickness metrology using focused beam interference" was invented by Venkatakaushik Voleti (Santa Clara, Calif.) and Mehdi Vaez-Iravani (Los Gatos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed systems and techniques are directed to interferometry-based sample thickness metrology in manufacturing systems. For example, the disclosed techniques include directing a focused beam to a plurality of locations of a sample and detecting an interference pattern (IP) associated with a light departing from the respective location and generated upon in...