US Patent Issued to APPLIED MATERIALS on Oct. 27 for "Heat transfer jackets and sensor assemblies, and related methods and processing chambers, for semiconductor manufacturing" (American, Indian Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,876, issued on Oct. 27, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Heat transfer jackets and sensor assemblies, and related methods and processing chambers, for semiconductor manufacturing" was invented by Vishwas Kumar Pandey (Madhya Pradesh, India) and Ala Moradian (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to heat transfer jackets and sensor assemblies, and related methods and processing chambers, for semiconductor manufacturing. In one or more embodiments, a jacket applicable for semiconductor manufacturing includes one or more outer walls bounding a plurality of fluid cha...