US Patent Issued to Applied Materials on Oct. 27 for "Grounding devices for substrate processing chambers" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,530, issued on Oct. 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Grounding devices for substrate processing chambers" was invented by Aki Hosokawa (Sunnyvale, Calif.) and Teng Mao Wang (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A grounding strap for a process chamber includes a core layer. The grounding strap further includes an outer layer. The outer layer includes at least 99% aluminum."

The patent was filed on Sept. 21, 2022, under Application No. 17/950,012.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOF...