US Patent Issued to Applied Materials on Nov. 3 for "Semiconductor manufacturing process chamber cooling flange for remote plasma source supply" (Indian, American Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,785,044, issued on Nov. 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Semiconductor manufacturing process chamber cooling flange for remote plasma source supply" was invented by Amit Sahu (Bangalore, India), Shashidhara Patel H B (Bangalore, India), Muhannad Mustafa (Milpitas, Calif.), Rakesh Ramadas (San Jose, Calif.) and Sanjeev Baluja (Campbell, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Cooling flanges and semiconductor manufacturing processing chamber comprising the cooling flanges are disclosed. The cooling flanges comprise a flange body with a gas channel extending through the length thereof. The gas channel has an i...