US Patent Issued to Applied Materials on May 26 for "Wafer edge profile control using connected edge ring hardware" (American, Swiss, Indian Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,640,353, issued on May 26, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Wafer edge profile control using connected edge ring hardware" was invented by Andreas Schmid (Meyriez, Switzerland), Sahiti Nallagonda (Santa Clara, Calif.), Peter Muraoka (Santa Clara, Calif.), Michael T. Nichols (Sunnyvale, Calif.), Denis Martin Koosau (Sunnyvale, Calif.), Stephen D. Prouty (San Jose, Calif.), Sunil Srinivasan (San Jose, Calif.) and Pranav Badole (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein generally related to a substrate processing apparatus. In one embodiment, a process kit for a substrate proce...