US Patent Issued to APPLIED MATERIALS on May 19 for "Upper edge ring of a process kit for semiconductor substrate processing" (California Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. D1,126,933, issued on May 19, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Upper edge ring of a process kit for semiconductor substrate processing" was invented by Muhannad Mustafa (Santa Clara, Calif.), Muhammad M. Rasheed (San Jose, Calif.), Yu Lei (Belmont, Calif.), Avgerinos V. Gelatos (Redwood City, Calif.), Vikash Banthia (Los Altos, Calif.), Victor H. Calderon (Sunnyvale, Calif.), Shi Wei Toh (Sunnyvale, Calif.), Yung-Hsin Lee (San Jose, Calif.) and Anindita Sen (San Jose, Calif.).

The patent was filed on July 11, 2022, under Application No. D/845,749.

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