US Patent Issued to Applied Materials on May 19 for "Embedding redistribution layer metal traces in a polymeric dielectric" (Singaporean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,494, issued on May 19, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Embedding redistribution layer metal traces in a polymeric dielectric" was invented by Peng Suo (Singapore), Chang Bum Yong (Singapore), Guan Huei See (Singapore) and Arvind Sundarrajan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus and methods for fabricating an electronic device are provided herein. Some embodiments include selectively delivering, according to a digital transfer pattern, an electromagnetic radiation beam provided from a light source across portions of an electromagnetic radiation sensitive layer that comprises a first photosen...