ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,400, issued on May 12, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Seam free titanium nitride gapfill" was invented by Radhika P. Patil (Mountain View, Calif.), Tatsuya E. Sato (San Jose, Calif.), Haoyan Sha (San Jose, Calif.), Abinash Tripathy (Santa Clara, Calif.), Michael S. Jackson (Sunnyvale, Calif.) and Janardhan Devrajan (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure relate to methods of depositing seam-free gapfill. In some embodiments, the gapfill consists of titanium nitride. The gapfill methods comprise forming a first layer and a second layer. The firs layer is formed w...