US Patent Issued to Applied Materials on May 12 for "In-chamber metrology of substrates for process characterization and improvement" (Indian, American Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,609, issued on May 12, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"In-chamber metrology of substrates for process characterization and improvement" was invented by Tapashree Roy (Bangalore, India), Todd Egan (Fremont, Calif.), Viswanath Bavigadda (Bengaluru, India) and Nitin Gupta (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes receiving, by a processing device, first data generated by a first sensor of a substrate processing system. The first data is generated responsive to the first sensor receiving electromagnetic radiation from a substrate held by a robot arm of a transfer chamber in the subst...