US Patent Issued to Applied Materials on March 17 for "Reconfigurable optical interconnects for co-packaged devices including photonic integrated circuits" (California Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,527, issued on March 17, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Reconfigurable optical interconnects for co-packaged devices including photonic integrated circuits" was invented by Olufemi I. Dosunmu (San Jose, Calif.), Zijiao Yang (Fremont, Calif.) and Jinxin Fu (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system includes an optical interconnect and a set of photonic integrated circuits (PICs) integrated within the optical interconnect. The optical interconnect includes a plurality of optical switches, a plurality of multiplexers, and a plurality of sets of optical splitters. Each multiplexer of the...