ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,972, issued on June 9, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Field suppressed metal gapfill" was invented by Annamalai Lakshmanan (Fremont, Calif.), Yixiong Yang (Fremont, Calif.), Srinivas Gandikota (Santa Clara, Calif.), Joung Joo Lee (San Jose, Calif.), Liqi Wu (San Jose, Calif.), Jie Zhang (Sunnyvale, Calif.), Tuerxun Ailihumaer (Santa Clara, Calif.) and Yogesh Sharma (Sunnyvale, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure relate to methods for bottom-up metal gapfill without substantial deposition outside of the feature. Additional embodiments provide a method of forming a metal ma...