US Patent Issued to Applied Materials on June 30 for "Substrate warpage reduction" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,520, issued on June 30, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Substrate warpage reduction" was invented by Jooho Lee (Osan-si, South Korea) and Youngho Kim (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include a processing system. The processing system includes a processing chamber, a processing volume; a substrate support assembly including a substrate support surface, a backside gas cavity, and a heater. The system includes a vacuum source in communication with the processing volume and the backside gas cavity. The system includes a backside gas resource in communicat...