US Patent Issued to Applied Materials on June 23 for "Modular high-frequency source" (California Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,665,169, issued on June 23, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Modular high-frequency source" was invented by Thai Cheng Chua (Cupertino, Calif.), Christian Amormino (San Jose, Calif.), Hanh Nguyen (San Jose, Calif.), Kallol Bera (San Jose, Calif.) and Philip Allan Kraus (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicato...