US Patent Issued to Applied Materials on June 23 for "Flowable CVD film defect reduction" (California Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,886, issued on June 23, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Flowable CVD film defect reduction" was invented by Wenhui Li (San Jose, Calif.), Praket P. Jha (San Jose, Calif.), Mandar B. Pandit (Milpitas, Calif.), Man-Ping Cai (Saratoga, Calif.), Jingmei Liang (San Jose, Calif.) and Michael Wenyoung Tsiang (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Processing methods disclosed herein comprise forming a nucleation layer and a flowable chemical vapor deposition (FCVD) film on a substrate surface by exposing the substrate surface to a silicon-containing precursor and a reactant. By controlling at least on...