US Patent Issued to Applied Materials on June 16 for "System and method for auto correction of substrate misalignment" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,523, issued on June 16, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"System and method for auto correction of substrate misalignment" was invented by Zhepeng Cong (San Jose, Calif.), Tao Sheng (Santa Clara, Calif.) and Martin Jeffrey Salinas (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein relate semiconductor manufacturing and processing. More particularly, a processing systems for auto correcting misalignments of substrates in process chambers is provided. The processing system includes a process chamber having a substrate support disposed within a chamber volume of the process chamber...