US Patent Issued to Applied Materials on July 7 for "Low temperature measurement of semiconductor substrates" (American, Null Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,626, issued on July 7, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Low temperature measurement of semiconductor substrates" was invented by Wolfgang R. Aderhold (Cupertino, Calif.) and Stephen Moffatt (St. Brelade, Jersey).

According to the abstract* released by the U.S. Patent & Trademark Office: "Examples described herein generally relate to apparatus and methods for rapid thermal processing (RTP) of a substrate. The present disclosure discloses pulsed radiation sources used to measure a broad range of low to high temperatures in the RTP chamber, each at a discrete wavelength, are used at a low temperature regime before using one laser at a discrete wavelength...