US Patent Issued to APPLIED Materials on July 7 for "Inductive sensor interface for on-wafer plating thickness measurements" (Montana Inventor)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,674,655, issued on July 7, was assigned to APPLIED Materials Inc. (Santa Clara, Calif.).

"Inductive sensor interface for on-wafer plating thickness measurements" was invented by Carl X. McShane (Marion, Mont.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor interface configured to determine a thickness of plating on a wafer, including an inductance to digital converter (LDC) configured to receive an input from a coil sensor, and configured to convert the input to data, a microcontroller (MCU) configured to receive the data, a digital to analog convertor (DAC) configured to convert the data to an analog signal, and an amplifier configured to output...