US Patent Issued to Applied Materials on July 28 for "Substrate support assembly with improved thermal uniformity" (California Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,071, issued on July 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Substrate support assembly with improved thermal uniformity" was invented by Vijay D. Parkhe (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for improving thermal uniformity on a surface of a substrate support assembly. One method includes temporarily clamping a ceramic puck plate to a cooling plate of a substrate support assembly with one or more layers of bonding material between the ceramic puck and the cooling plate. The method further includes heating the ceramic puck plate to a target temperature, cooling the cooling plate to an oper...