US Patent Issued to Applied Materials on July 28 for "Fin structures, plate apparatus, and related methods, process kits, and processing chambers for growth rates and process uniformity" (California Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,715, issued on July 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Fin structures, plate apparatus, and related methods, process kits, and processing chambers for growth rates and process uniformity" was invented by Zhepeng Cong (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to semiconductor processing chambers, and more particularly, to fin structures that facilitate growth rates and process uniformity. In one or more embodiments, a processing chamber applicable for use in semiconductor manufacturing includes one or more gas inlets operable to flow a gas into an internal volume of...