US Patent Issued to Applied Materials on July 21 for "Semiconductor processing tool platform configuration with reduced footprint" (California, Texas Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,410, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Semiconductor processing tool platform configuration with reduced footprint" was invented by Nir Merry (Mountain View, Calif.), Schubert S. Chu (San Francisco), Sushant S. Koshti (Sunnyvale, Calif.), Michael C. Kuchar (Georgetown, Texas), Nyi Oo Myo (San Jose, Calif.) and Songjae Lee (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing system includes a factory interface, a transfer chamber of heptagonal shape and including four first facets and three second facets, each having a width that is narrower than that of each of the fo...