US Patent Issued to Applied Materials on July 21 for "Methods and apparatus for processing a substrate" (Indian, American Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,411, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Methods and apparatus for processing a substrate" was invented by Gaurav Shrivastava (Bengaluru, India), Pavankumar Ramanand Harapanhalli (Bangalore, India), Yao-Hung Yang (Santa Clara, Calif.), Sudhir R. Gondhalekar (Fremont, Calif.) and Chih-Yang Chang (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus for processing a substrate are provided herein. For example, a processing volume for processing a substrate and a pressure system in fluid communication with the processing volume and comprising a throttle valve assembly incl...