US Patent Issued to Applied Materials on July 14 for "Wafer edge profile control using connected edge ring hardware" (American, Swiss, Indian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,136, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Wafer edge profile control using connected edge ring hardware" was invented by Andreas Schmid (Meyriez, Switzerland), Sahiti Nallagonda (Santa Clara, Calif.), Peter Muraoka (Santa Clara, Calif.), Michael T. Nichols (Sunnyvale, Calif.), Denis Martin Koosau (Sunnyvale, Calif.), Stephen D. Prouty (San Jose, Calif.), Sunil Srinivasan (San Jose, Calif.) and Pranav Badole (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein generally related to a substrate processing apparatus. In one embodiment, a process kit for a substrate pro...