US Patent Issued to Applied Materials on July 14 for "Pressure puck diagnostic wafer" (American, French Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,076, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Pressure puck diagnostic wafer" was invented by Kostiantyn Achkasov (Lyons, France), Peter Reimer (San Jose, Calif.), Shawn Thanhson Le (San Jose, Calif.) and Sohrab Zokaei (Los Altos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary diagnostic wafers for a semiconductor processing chamber may include a wafer body defining a plurality of recesses. The diagnostic wafers may include at least one data logging puck positionable within one of the plurality of recesses. The diagnostic wafers may include at least one battery puck positionable within one of...